Kusmiati, Assorted Banana Chips business "Kurnia", one of the micro, small, and medium enterprises at Rumah BUMN Mempawah, West Kalimantan, which has upgraded its packaging under the guidance of Telkom.

Rumah BUMN Telkom Hosts Packaging Festival 2023 with Over 200 MSME Participants

Jakarta, 22 August 2023 – Aligned with the government's initiative to enhance the global competitiveness of micro, small, and medium enterprises, PT Telkom Indonesia (Persero) Tbk (Telkom) through Rumah BUMN Telkom invited micro, small, and medium enterprises players in Indonesia to elevate the quality of their businesses through the Packaging Festival (PackFest) 2023 program recently.

"This initiative reflects Telkom's commitment to empower micro, small, and medium enterprises in enhancing product management through packaging. High-quality packaging enhances marketing potential and product value. Keeping up with current trends is crucial, as products with attractive packaging often become viral, serving as a distinctive business identity," said Hery Susanto, SGM of Telkom Community Development Center.

The program aims to innovate and elevate the quality of micro, small, and medium enterprises (MSMEs) products in Indonesia by providing subsidies for upgrading product packaging. This enables micro, small, and medium enterprises to create high-quality packaging with unique designs that serve as effective promotional tools. Additionally, the program aligns with Sustainable Development Goals (SDGs) such as poverty alleviation (Goal 1) and economic growth and livelihoods (Goal 8).

The 2023 Packaging Festival was attended by 38 BUMN Houses, with the highest micro, small, and medium enterprises participation from Rumah BUMN Palu, Rumah BUMN Malang, Rumah BUMN Lubuk Pakam, Rumah BUMN Parepare, and Rumah BUMN Tarakan. More than 200 micro, small, and medium enterprises participated, totaling 198,500 requests for packaging upgrades.

As of August 2023, 29,000 packages have entered the printing process, with the remaining in the design phase. Materials used in Packfest 2023 include non-ziplock metal paper and super aluminum ziplock, featuring full-print packaging in four sizes: 13 cm x 20 cm, 14 cm x 24 cm, 16 cm x 25 cm, and 18 cm x 29 cm.

This initiative aims to foster creative and globally competitive micro, small, and medium enterprises. Rumah BUMN Telkom remains committed to innovating and enhancing micro, small, and medium enterprises quality in Indonesia through the Packaging Festival program.

#ElevatingYourFuture